Wafer Support Member - List of Manufacturers, Suppliers, Companies and Products | IPROS GMS

Wafer support member for semiconductor manufacturing process (CFRP wafer ring development product)

Developed a dicing frame (wafering) using CFRP 3D printing technology. It is lightweight and has high rigidity, making it excellent for wafer transportability.

- Manufactured using continuous carbon fiber 3D printing and press molding technology. - Smooth appearance with no catches. - Lightweight and particularly excellent in circumferential strength and rigidity. - Does not experience expansion or contraction due to temperature changes like stainless steel.